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electroplating intermediates

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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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electroplating intermediates

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PN Acid Copper Intermediates High Molecular Polymer For Acid Copper Brightener
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PN, Electroplating intermedaite for acid copper, a derivative of polyethyleneimine, leveling agent in LCD area Specifications Concentration 50% Content in Baths 0.01-0.02ml/L Consumption 0.5-1ml/KAH Appearance ... Read More

2019-08-06 17:43:07

DPS Acid Copper Brightener , CAS 18880 36 9 Copper Electroplating Brightener
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DPS, Electroplating additive and intermedaite for acid copper, N,N-Dimethyl-dithiocarbamyl propyl sul, grain refiner Specifications Molecular Formula C6H12NNaO3S3 Assay (HPLC) 98% Molecular Weight 265 CAS No. ... Read More

2019-08-06 17:32:02

BEO Nickel Electroplating Chemicals Lasting Leveling Agent For Nickel Plating Baths
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BEO, Electroplating intermedaite for nickel plating, 1,4-Bis(2-hydroxyethoxy)-2-butyne, brightener, leveling agent Specifications Molecular Formula C8H14O4 Assay (GC) 98% Molecular Weight 174.20 CAS No. 1606-85... Read More

2019-08-06 17:52:00

PME Electroplating Brightener As Leveling And Fast Brightening Agent
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PME, Electroplating intermedaite for nickel plating, Propynol ethoxylate, brightener, leveling agent Specifications Molecular Formula C5H8O2 Assay (GC) 98% Molecular Weight 100.12 CAS No. 3973-18-0 Content in ... Read More

2019-08-06 17:52:00

MPS Electroplating Additives Sodium 3 - Mercaptopropane Sulphonate C3H7NaO3S2
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MPS, Electroplating additive and intermedaite for acid copper, Sodium 3-mercaptopropanesulphonate, grain refiner Specifications Molecular Formula C3H7O3S2Na Assay (HPLC) 95% Molecular Weight 178.21 CAS No. ... Read More

2019-08-06 17:32:02

DEP Nickel Plating Solution , Insoluble In Water Nickel Electroplating Brightener
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DEP, Electroplating intermedaite for nickel plating, N,N-Diethyl-2-propynylamine, brightener, leveling agent Specifications Molecular Formula C7H13N Assay 98% Molecular Weight 111.19 CAS No. 4079-68-9 Content ... Read More

2019-08-06 17:52:00

TC-EHS Electroplating Wetting Agent For Nickel Plating Sodium 2 Ethylhexyl Sulfate
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TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More

2019-08-15 10:32:01

MTSS Electroplating Intermediates , High Throwing Power Leveling Agent
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MTSS, Electroplating intermedaite for nickel plating, throwing power, covering, LCD leveling Specifications Concentration 60% Content in Baths 0.2-0.4ml/L Consumption 2-5ml/KAH Appearance Yellowish liquid ... Read More

2019-08-15 11:10:02

BOZ Nickel Plating Brightener Colorless Or Yellowish Crystal 10-20g/KAH Consumption
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BOZ, Electroplating intermedaite for nickel plating, 1,4-Dihydroxy-2-butyne, brightener, leveling agent Specifications Molecular Formula C4H6O2 Molecular Weight 86.09 CAS No. 110-65-6 Content in Baths 0.1-0.3g... Read More

2019-08-06 17:52:00

Wetting Agent, Polyethylene Glycol Powder For Acid Copper, copper baths
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PEG, Electroplating intermediate for acid copper, Polyethylene glycol, carrier, wetting agent Specifications Molecular Formula HO(CH2CH2O)nH Assay (HPLC) 99% Molecular Weight 6000-10000 CAS No. 25322-68-3 ... Read More

2019-08-15 10:32:01

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