98% content TPS Sodium Dimethylformamide Propane Sulfonate

98% content TPS Sodium Dimethylformamide Propane Sulfonate

Applications
The performance of TPS is similar to that of SP, and its high-temperature positioning performance is excellent, and the brightener component performance is easier to control. Usually TPS is used to replace a part of SP to improve the positioning performance of the brightener. Suitable for hardware acid copper plating, circuit board copper plating, hard copper plating and other processes. Consumption: 0.3-0.5g/KAH.
Hardware acid copper plating process-non-dye system
TPS and SPS, M, NGISS, AESSPN, PPNIPNI
Several intermediates such as POSS, CPSS, P, MT-580, MT480, etc. are reasonably matched to form a dye-free acid copper brightener. TPS recommends the dosage in the working solution is 0.01-002g/L, and the content in the plating solution is too low , The leveling and brightness of the coating is reduced, and the high area is easy to produce burrs or burnt; too high coating will produce white fog, and it will also cause defects in the low area. You can add a small amount of M, N or add a proper amount of low area positioning agent AESS , PN, PPNI, etc. to offset the side effects of excessive TPS or electrolytic treatment.

Hardware Acid Copper Plating Process-Dye System
TPS is reasonably matched with MTOY, MDER, MDOR, DYEB, DYER, MT-580, MT-880MT480PNIPPNIAESS, PN, GISS and other intermediates to form a dye-type acid copper brightener. The recommended amount of TPS in the working solution is 0.01-002g/L If the content in the plating solution is too low, the leveling and brightness of the plating layer will decrease, and the high area will easily produce burrs or burnt; too high a plating layer will produce white fog and also cause defects in the low area. A small amount of agent A can be added to offset the TPS The side effects may be treated with activated carbon adsorption and electrolysis.

Upon the development for decades, Mengde has succeeded in working out some 100 kinds of special electroplating chemicals and obtains the vanguard role in the domain of electroplating intermediates, such as acid copper plating and nickel plating, among which the derivatives of 1,3-propanesultone, alkynol and MDG polyethyleneimine are the most widely applied in the line of electroplating. Through the study of electrochemistry and related materials, as well as the integrated applications of electroplating processes and additive formulas, Mengde now successfully creates various kinds of top-grade electroplating additives featured with distinctive advantages and is granted with reputation through trial and error. In terms of circuit board, by years’ accumulation of technical experience, Mengde has acquired powerful researching capacity. From the perspective of new energy, Mengde is committed to the research and development of lithium ion battery electrolyte to elevate the lifespan and safety of the lithium ion battery.