SH110 Electroplating Additive , Hard Copper Process Copper Plating Brightener

SH110, Electroplating additive and intermedaite for acid copper, grain refiner, leveling agent

Specifications

Description

• SH110 is the combination of grain refining and leveling which is quite suitable for printed circuit board and hard copper plating.
• When SH110 is used in printed circuit board plating, the concentration of SH110 in bath is 1-2 mg/L and the consumption is 0.3-0.8g/KAH.
• When SH110 is used in hard copper plating, the concentration of SH110 in bath is 10-30mg/L and the consumption is 0.5-1.5g/KAH.
• A loose of throwing may occur if too much SH110 is in baths.

Applications

SH110 can be combined with other acid copper intermediates such as SLP, PEG 6000, MT-580, AESS, etc.
SPS can be applied on the following process:

• Acid copper for PCB (Printed Circuit Board) process
• Hard copper process
•  

Packing and Storage

Packed in a carboard drum with plastic inner bags, stored in cool and dry place​.

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