SPS 27206-35-5 applied to brightener for acid copper plating

SPS 27206-35-5 applied to brightener for acid copper plating

    SPS contains increased amount of SP. Replacing SP with SPS to be the acid copper plating brightener agent provides ornamental and functional plating layers. SPS could be combined with nonionic surface-active agent, amine compounds and other sulfenyl compounds which exist in typical copper plating formula. Also, it could be combined with dyes to better plating effects.

Applications

SPS can be combined with other acid copper intermediates such as M, N, PEG 6000, MT-580, AESS, acid copper dyes, etc.
SPS can be applied on the following process:

• Dye based bright acid copper for GMF process
• Non-dye based bright acid copper for GMF process
• Acid copper for PCB (Printed Circuit Board) process
• Hard copper process
• Acid copper for electrolytic copper foil proces

Properties

Upon the development for decades, Mengde has succeeded in working out some 100 kinds of special electroplating chemicals and obtains the vanguard role in the domain of electroplating intermediates, such as acid copper plating and nickel plating, among which the derivatives of 1,3-propanesultone, alkynol and MDG polyethyleneimine are the most widely applied in the line of electroplating. Through the study of electrochemistry and related materials, as well as the integrated applications of electroplating processes and additive formulas, Mengde now successfully creates various kinds of top-grade electroplating additives featured with distinctive advantages and is granted with reputation through trial and error. In terms of circuit board, by years’ accumulation of technical experience, Mengde has acquired powerful researching capacity. From the perspective of new energy, Mengde is committed to the research and development of lithium ion battery electrolyte to elevate the lifespan and safety of the lithium ion battery.