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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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DOSS Nickel Baths Softener White Powder For Ferro - Nickel Alloy Plating Process
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DOSS, Electroplating intermedaite for nickel plating, softener Specifications Assay 98% Content in Baths 0.04-0.06g/L Consumption 2-5g/KAH Appearance White powder Description DOSS can remarkably improve the ... Read More

2019-08-15 11:13:01

Electroplating Intermediate Plating Solutions Chemicals MT 480 With Good Throwing Power
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MT-480, Electroplating intermediate for acid copper, wetting agent Specifications Concentration 50% Content in Baths 0.2-0.4ml/L Consumption 1-2ml/KAH Appearance Yellowish liquid Description MT-480 is a kind of ... Read More

2019-08-15 10:32:01

SSO3, agent for removing iron impurity in nickel baths, Impurities tolerance agent
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Specifications Content in Baths 0.001-0.02ml/L Consumption 2g/KAH Appearance Colorless and transparent liquid Description SSO3 has good throwing power and tolerance against impurities. Packing and Storage ... Read More

2019-08-15 11:26:04

ALS Sodium Allylsulfonate Throwing Power Clear Colorless Or Yellowish Liquid
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ALS, Electroplating intermedaite for nickel plating, Sodium allylsulfonate, throwing power Specifications Molecular Formula C3H5NaO3S Concentration 25% Molecular Weight 144.12 CAS No. 2495-39-8 Content in Baths ... Read More

2019-08-15 11:10:02

BBI Nickel Baths Softener C12H11NO4S2 White Powder For Produce A Bright White Deposit
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BBI, Electroplating intermedaite for nickel plating, Bis(benzene sulphonyl)-imide, softener Specifications Molecular Formula C12H11NO4S2 Assay(HPLC) 98% Molecular Weight 297.34 CAS No. 2618-96-4 Content in ... Read More

2019-08-15 11:13:01

MPS Acid Copper Plating Brighteners Sodium 3 - Mercaptopropane Sulfonate
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MPS, Electroplating additive and intermedaite for acid copper, Sodium 3-mercaptopropanesulphonate, grain refiner Specifications Molecular Formula C3H7O3S2Na Assay (HPLC) 95% Molecular Weight 178.21 CAS No. ... Read More

2019-08-06 17:32:02

QF, agent for removing iron impurity in nickel baths, Fe ion purifier
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Specifications Content in Baths 0.1-0.2ml/L Consumption Depend on the amount of iron ions Appearance White crystal powder Description >50mg iron ion in nickel-plating baths can cause burning or pores. Adding QF ... Read More

2019-08-15 11:26:04

AESS Acid Copper Intermediates Electroplating Intermediate Excellent Throwing Power
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SPS Acid Copper Plating Brighteners Electroplating Additive And Intermediate Specifications Assay 50% Content in Baths 0.005-0.02ml/L Consumption 1-2ml/KAH Appearance Reddish brown liquid Description AESS is an ... Read More

2019-08-06 17:43:07

TC-EHS Electroplating Wetting Agent CAS 126 92 1 C8H17NaO4S Yellow Liquid
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TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More

2019-08-15 10:32:01

BEO Nickel Electroplating Chemicals Lasting Leveling Agent For Nickel Plating Baths
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BEO, Electroplating intermedaite for nickel plating, 1,4-Bis(2-hydroxyethoxy)-2-butyne, brightener, leveling agent Specifications Molecular Formula C8H14O4 Assay (GC) 98% Molecular Weight 174.20 CAS No. 1606-85... Read More

2019-08-06 17:52:00

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