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electroless nickel plating process

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electroless nickel plating process

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buy Semi Bright  Nickel Plating Process HD Series With Good Dispersing Ability online manufacturer

Semi Bright Nickel Plating Process HD Series With Good Dispersing Ability

HD series, Semi-bright nickel plating process, ready to use, rack plating Applications and advantages Can be used in watt nickel process, producing semi-bright nickel deposit. Sulphur-free, no brittleness, and ... Read More
2019-08-06 17:53:15
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Easy Operate Bright Nickel Plating Solution NI 88 Series With High Performance

NI-88 series, bright nickel plating process, nickel plating brighteners, ready to use, rack plating Applications and advantages Used in chromium, bronze, gold, and silver plating as the base deposit under ... Read More
2019-08-06 17:53:15
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HD Series Semi Bright Nickel Plating Solution For Watt Nickel Process

HD series, Semi-bright nickel plating process, ready to use, rack plating Applications and advantages Can be used in watt nickel process, producing semi-bright nickel deposit. Sulphur-free, no brittleness, and ... Read More
2019-08-06 17:53:15
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Electroplating Intermediate Plating Solutions Chemicals MT 480 With Good Throwing Power

MT-480, Electroplating intermediate for acid copper, wetting agent Specifications Concentration 50% Content in Baths 0.2-0.4ml/L Consumption 1-2ml/KAH Appearance Yellowish liquid Description MT-480 is a kind of ... Read More
2019-08-15 10:32:01
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Low Foam Acid Copper Wetting Agent For PCB Process

MT-880, Electroplating intermedaite for acid copper, wetting agent Specifications Concentration 80% Content in Baths 0.08-0.2ml/L Consumption 10-20ml/KAH Appearance Yellowish liquid Description MT-880 is a kind ... Read More
2019-08-15 10:32:01
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TC-EHS Electroplating Wetting Agent CAS 126 92 1 C8H17NaO4S Yellow Liquid

TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More
2019-08-15 10:32:01
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DEP Electroplating Intermediates CAS 4079 68 9 Bright Nickel Plating For GMF Process

DEP, Electroplating intermedaite for nickel plating, N,N-Diethyl-2-propynylamine, brightener, leveling agent Specifications Molecular Formula C7H13N Assay 98% Molecular Weight 111.19 CAS No. 4079-68-9 Content ... Read More
2019-08-06 17:52:00
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TC-EHS Electroplating Wetting Agent For Nickel Plating Sodium 2 Ethylhexyl Sulfate

TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More
2019-08-15 10:32:01
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BEO Nickel Electroplating Chemicals Lasting Leveling Agent For Nickel Plating Baths

BEO, Electroplating intermedaite for nickel plating, 1,4-Bis(2-hydroxyethoxy)-2-butyne, brightener, leveling agent Specifications Molecular Formula C8H14O4 Assay (GC) 98% Molecular Weight 174.20 CAS No. 1606-85... Read More
2019-08-06 17:52:00
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PAP Nickel Plating Brightener Propargyl Alcohol Propoxylate CAS 3973 17 9

PAP, Electroplating intermedaite for nickel plating, Propargyl alcohol propoxylate, brightener, leveling agent Specifications Molecular Formula C6H10O2 Assay (GC) 85% Molecular Weight 114.14 CAS No. 3973-17-9 ... Read More
2019-08-06 17:52:00
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