Low Foam Acid Copper Wetting Agent For PCB Process

MT-880, Electroplating intermedaite for acid copper, wetting agent

Specifications

Description

1. MT-880 is a kind of low–foam acid copper wetting agent which effectively prevents the emergence of pores, and it has excellent leveling and throwing power.
2. There is no hydrophobic membrane on the surface of deposit. It effectively curbs the decomposition of brightener and elevates the stability of baths.

Applications

MT-880 can be combined with other nickel plating intermediates such as SPS, PNI, MT-580 and dyestaff.
MT-880 can be applied on the following process:

• Dye based bright acid copper for GMF process
• Non-dye based bright acid copper for GMF process
• Acid copper for PCB (Printed Circuit Board) process

Packing and Storage

Packed in a plastic drum, stored in cool and dry place.

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