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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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granular wetting agent

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Polyethylene Glycol Copper Plating Process Carrier / Wetting Agent
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PEG, Electroplating intermedaite for acid copper, Polyethylene glycol, carrier, wetting agent Specifications Molecular Formula HO(CH2CH2O)nH Assay (HPLC) 99% Molecular Weight 6000-10000 CAS No. 25322-68-3 ... Read More

2020-05-05 09:39:41

TC-EHS Electroplating Wetting Agent CAS 126 92 1 C8H17NaO4S Yellow Liquid
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TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More

2019-08-15 10:32:01

80% Concentration Liquid Wetting Agent Electroplating Intermediate
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MT-880, Electroplating intermedaite for acid copper, wetting agent Specifications Concentration 80% Content in Baths 0.08-0.2ml/L Consumption 10-20ml/KAH Appearance Yellowish liquid Description MT-880 is a kind ... Read More

2019-08-15 10:32:01

TC-EHS Electroplating Wetting Agent For Nickel Plating Sodium 2 Ethylhexyl Sulfate
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2019-08-15 10:32:01

MT-580 Acid Copper Wetting Agent Yellowish Liquid
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MT-580, Electroplating intermediate for acid copper, wetting agent Specifications Concentration 50% Content in Baths 0.1-0.2ml/L Consumption 10-20ml/KAH Appearance Yellowish liquid Description Proper amount of ... Read More

2019-08-15 10:32:01

Wetting Agent, Polyethylene Glycol Powder For Acid Copper, copper baths
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PEG, Electroplating intermediate for acid copper, Polyethylene glycol, carrier, wetting agent Specifications Molecular Formula HO(CH2CH2O)nH Assay (HPLC) 99% Molecular Weight 6000-10000 CAS No. 25322-68-3 ... Read More

2019-08-15 10:32:01

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