Polyethylene Glycol Copper Plating Process Carrier / Wetting Agent

PEG, Electroplating intermedaite for acid copper, Polyethylene glycol, carrier, wetting agent

Specifications

Description

1. PEG must be used in combination with other acid copper intermediates, such as SPS, M and N, to get brightening deposit.
2. A low content of PEG in acid copper baths can cause brightness and leveling reduced, a excessive content of PEG in baths can remarkably reduce the adhesion.

Applications

PEG can be combined with other acid copper intermediates such as M, N, SPS, MT-580, AESS, etc.
PEG can be applied on the following process:

• Non-dye based bright acid copper for GMF process
• Acid copper for PCB (Printed Circuit Board) process
• Hard copper process
• Acid copper for electrolytic copper foil process

Packing and Storage

Packed in a carboard drum with plastic inner bags, stored in cool and dry place​.

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