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nickel electroplating process

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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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nickel electroplating process

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Semi Bright Nickel Plating Process HD Series With Good Dispersing Ability
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HD series, Semi-bright nickel plating process, ready to use, rack plating Applications and advantages Can be used in watt nickel process, producing semi-bright nickel deposit. Sulphur-free, no brittleness, and ... Read More

2019-08-06 17:53:15

Easy Operate Bright Nickel Plating Solution NI 88 Series With High Performance
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NI-88 series, bright nickel plating process, nickel plating brighteners, ready to use, rack plating Applications and advantages Used in chromium, bronze, gold, and silver plating as the base deposit under ... Read More

2019-08-06 17:53:15

High Performance Nickel Plating Brightener, ready to use, bright nickel
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Ni-88 High Performance Bright Nickel Plating Process Applications and advantages Used in chromium, bronze, gold, and silver plating as the base deposit under bright nickel layer. Has excellent covering and ... Read More

2019-08-08 09:58:21

BEO Nickel Electroplating Chemicals Lasting Leveling Agent For Nickel Plating Baths
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BEO, Electroplating intermedaite for nickel plating, 1,4-Bis(2-hydroxyethoxy)-2-butyne, brightener, leveling agent Specifications Molecular Formula C8H14O4 Assay (GC) 98% Molecular Weight 174.20 CAS No. 1606-85... Read More

2019-08-06 17:52:00

1 4 Dihydroxy 2 Butyne Nickel Electroplating Intermediates C4H6O2 CAS 110 65 6
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BOZ, Electroplating intermedaite for nickel plating, 1,4-Dihydroxy-2-butyne, brightener, leveling agent Specifications Molecular Formula C4H6O2 Molecular Weight 86.09 CAS No. 110-65-6 Content in Baths 0.1-0.3g... Read More

2019-08-06 17:52:00

TC-EHS Electroplating Wetting Agent For Nickel Plating Sodium 2 Ethylhexyl Sulfate
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TC-EHS, Electroplating intermedaite for nickel plating, Sodium 2-ethylhexyl sulfate, wetting agent Specifications Molecular Formula C8H17NaO4S Concentration 38% Molecular Weight 232.27 CAS No. 126-92-1 Content ... Read More

2019-08-15 10:32:01

DEP Nickel Plating Solution , Insoluble In Water Nickel Electroplating Brightener
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DEP, Electroplating intermedaite for nickel plating, N,N-Diethyl-2-propynylamine, brightener, leveling agent Specifications Molecular Formula C7H13N Assay 98% Molecular Weight 111.19 CAS No. 4079-68-9 Content ... Read More

2019-08-06 17:52:00

Electroplating Intermediate Plating Solutions Chemicals MT 480 With Good Throwing Power
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MT-480, Electroplating intermediate for acid copper, wetting agent Specifications Concentration 50% Content in Baths 0.2-0.4ml/L Consumption 1-2ml/KAH Appearance Yellowish liquid Description MT-480 is a kind of ... Read More

2019-08-15 10:32:01

Low Foam Acid Copper Wetting Agent For PCB Process
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MT-880, Electroplating intermedaite for acid copper, wetting agent Specifications Concentration 80% Content in Baths 0.08-0.2ml/L Consumption 10-20ml/KAH Appearance Yellowish liquid Description MT-880 is a kind ... Read More

2019-08-15 10:32:01

BOZ Nickel Plating Brightener Colorless Or Yellowish Crystal 10-20g/KAH Consumption
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2019-08-06 17:52:00

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