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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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구리 전기 성형 brightener

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GISS Acid Copper Intermediates For Acid Copper A Derivative Of Polyethyleneimine
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GISS, Electroplating intermedaite for acid copper, a derivative of polyethyleneimine, leveling agent in LCD area Specifications Concentration 50% Content in Baths 0.01-0.02ml/L Consumption 1-2ml/KAH Appearance ... Read More

2019-08-06 17:43:07

BBI Nickel Baths Softener C12H11NO4S2 White Powder For Produce A Bright White Deposit
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BBI, Electroplating intermedaite for nickel plating, Bis(benzene sulphonyl)-imide, softener Specifications Molecular Formula C12H11NO4S2 Assay(HPLC) 98% Molecular Weight 297.34 CAS No. 2618-96-4 Content in ... Read More

2019-08-15 11:13:01

Wetting Agent, Polyethylene Glycol Powder For Acid Copper, copper baths
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PEG, Electroplating intermediate for acid copper, Polyethylene glycol, carrier, wetting agent Specifications Molecular Formula HO(CH2CH2O)nH Assay (HPLC) 99% Molecular Weight 6000-10000 CAS No. 25322-68-3 ... Read More

2019-08-15 10:32:01

Low Foam Tin Plating Processes , Metal Surface Treatment Agent With Two Agents
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MDT-LS series, bright acid tin plating process, acid tin brighteners, ready to use MDT-LS Full Bright Acid Tin Plating Process (Low Foam, No Formaldehyde) Applications and advantages We developed brand-new full ... Read More

2019-08-06 18:14:03

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