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Acid Copper Plating Brighteners (11)
Acid Copper Intermediates (10)
Leveling Agent (15)
Electroplating Wetting Agent (10)
Bright Nickel Intermediates (15)
Nickel Plating Brightener (18)
Nickel Baths Softener (4)
Nickel Bath Purifier (10)
Copper Plating Process (4)
Tin Plating Process (3)
Nickel Plating Process (4)
Electroplating Chemicals (5)
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brightener επένδυσης χαλκού

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buy DPS Acid Copper Brightener , CAS 18880 36 9 Copper Electroplating Brightener online manufacturer

DPS Acid Copper Brightener , CAS 18880 36 9 Copper Electroplating Brightener
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DPS, Electroplating additive and intermedaite for acid copper, N,N-Dimethyl-dithiocarbamyl propyl sul, grain refiner Specifications Molecular Formula C6H12NNaO3S3 Assay (HPLC) 98% Molecular Weight 265 CAS No. ... Read More
2019-08-06 17:32:02
buy DPS Acid Copper Plating Brighteners N - Dimethyl - Dithiocarbamyl Propyl Sul online manufacturer

DPS Acid Copper Plating Brighteners N - Dimethyl - Dithiocarbamyl Propyl Sul
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DPS, Electroplating additive and intermedaite for acid copper, N,N-Dimethyl-dithiocarbamyl propyl sul, grain refiner Specifications Molecular Formula C6H12NNaO3S3 Assay (HPLC) 98% Molecular Weight 265 CAS No. ... Read More
2019-08-06 17:32:02
buy MPS Acid Copper Plating Brighteners Sodium 3 - Mercaptopropane Sulfonate online manufacturer

MPS Acid Copper Plating Brighteners Sodium 3 - Mercaptopropane Sulfonate
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MPS, Electroplating additive and intermedaite for acid copper, Sodium 3-mercaptopropanesulphonate, grain refiner Specifications Molecular Formula C3H7O3S2Na Assay (HPLC) 95% Molecular Weight 178.21 CAS No. ... Read More
2019-08-06 17:32:02
buy SPS Acid Copper Plating Brighteners Electroplating Additive And Intermediate online manufacturer

SPS Acid Copper Plating Brighteners Electroplating Additive And Intermediate
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SPS, Electroplating additive and intermedaite for acid copper, SPS Bis-(sodium sulfopropyl)-disulfide, grain refiner Specifications Molecular Formula C6H12Na2O6S4 Assay (HPLC) 90% Molecular Weight 354.4 CAS No. ... Read More
2019-08-06 17:32:02
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SH110 Electroplating Additive , Hard Copper Process Copper Plating Brightener
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SH110, Electroplating additive and intermedaite for acid copper, grain refiner, leveling agent Specifications Content in Baths Depends on the plating process Consumption Depends on the plating process ... Read More
2019-08-06 17:32:02
buy SH110 Acid Copper Plating Brighteners Yellowish Powder With Weak Odor online manufacturer

SH110 Acid Copper Plating Brighteners Yellowish Powder With Weak Odor
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SH110, Electroplating additive and intermedaite for acid copper, grain refiner, leveling agent Specifications Content in Baths Depends on the plating process Consumption Depends on the plating process ... Read More
2019-08-06 17:32:02
buy PME Electroplating Brightener As Leveling And Fast Brightening Agent online manufacturer

PME Electroplating Brightener As Leveling And Fast Brightening Agent
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PME, Electroplating intermedaite for nickel plating, Propynol ethoxylate, brightener, leveling agent Specifications Molecular Formula C5H8O2 Assay (GC) 98% Molecular Weight 100.12 CAS No. 3973-18-0 Content in ... Read More
2019-08-06 17:52:00
buy PAP Nickel Plating Brightener Propargyl Alcohol Propoxylate CAS 3973 17 9 online manufacturer

PAP Nickel Plating Brightener Propargyl Alcohol Propoxylate CAS 3973 17 9
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PAP, Electroplating intermedaite for nickel plating, Propargyl alcohol propoxylate, brightener, leveling agent Specifications Molecular Formula C6H10O2 Assay (GC) 85% Molecular Weight 114.14 CAS No. 3973-17-9 ... Read More
2019-08-06 17:52:00
buy MAP Nickel Plating Brightener 1 1 Dimethylpropargylamine Alkyne Amine Compound online manufacturer

MAP Nickel Plating Brightener 1 1 Dimethylpropargylamine Alkyne Amine Compound
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MAP, Electroplating intermedaite for nickel plating, 1,1-Dimethylpropargylamine, brightener, leveling agent Specifications Molecular Formula C5H9N Assay 95% Molecular Weight 83.13 CAS No. 2978-58-7 Content in ... Read More
2019-08-06 17:52:00
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BEO Nickel Plating Brightener C8H14O4 Brightener And Lasting Leveling Agent
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BEO, Electroplating intermedaite for nickel plating, 1,4-Bis(2-hydroxyethoxy)-2-butyne, brightener, leveling agent Specifications Molecular Formula C8H14O4 Assay (GC) 98% Molecular Weight 174.20 CAS No. 1606-85... Read More
2019-08-06 17:52:00
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Acid Copper Plating Brighteners

SH110 Acid Copper Plating Brighteners Yellowish Powder With Weak Odor

SH110 Electroplating Additive , Hard Copper Process Copper Plating Brightener

Nickel Plating Process

Wetting Agent, Polyethylene Glycol Powder For Acid Copper, copper baths

MT-480 Wetting Agent Intermediate For Acid Copper Baths

Leveling Agent And Brightener Nickel Plating Process Making Gorgeous Deposit

Leveling Agent

GISS Leveling Agent Electroplating Intermediate For Acid Copper Yellow Liquid

N Leveling Agent 1 3 - Ethylenethiourea Imidazoline - 2-Thiol Cas 96 45 7

M 2 Mercaptobenzimidazole Acid Copper Intermediate White Powder Cas 583 39 1

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