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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Tin Plating Process (3)

Nickel Plating Process (4)

Electroplating Chemicals (5)

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nickel plating solution

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HVEE Nickel Plating Process High Efficacious Catalyzer For Hard Chromium Plating
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HVEE, High-efficacious catalyzer for hard chromium plating, chromium plating intermediate Effects and mechanisms HVEE increases the cathode current efficiency to 22-26%, which is 2-3 times higher than the ... Read More

2019-08-15 11:16:03

MDG Nickel Plating Process Polyethyleneimine CAS 9002-98-6 99% High Purity
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MDG, Polyethyleneimine Applications MDG polyethyleneimine serial products are the key advanced products of our company. Not only is MDG quite active, but also its positive ion is highly dense. Its illustrated ... Read More

2019-08-15 11:16:03

PABS Diethylaminopropyne Formate Yellowish Transparent Liquid Good Leveling Ability
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Specifications Molecular Formula C7H13N.CH2O2 Assay 70% Molecular Weight 157.21 CAS No. 125678-52-6 Content in Baths 0.005-0.02ml/L Consumption 1-2ml/KAH Appearance Yellowish transparent liquid Description PABS ... Read More

2019-08-06 17:52:00

MTSS Electroplating Solution , Excellent Throwing Power Electroplating Additives
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MTSS, Electroplating intermedaite for nickel plating, throwing power, covering, LCD leveling Specifications Concentration 60% Content in Baths 0.2-0.4ml/L Consumption 2-5ml/KAH Appearance Yellowish liquid ... Read More

2019-08-15 11:10:02

1 4 Dihydroxy 2 Butyne Nickel Electroplating Intermediates C4H6O2 CAS 110 65 6
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BOZ, Electroplating intermedaite for nickel plating, 1,4-Dihydroxy-2-butyne, brightener, leveling agent Specifications Molecular Formula C4H6O2 Molecular Weight 86.09 CAS No. 110-65-6 Content in Baths 0.1-0.3g... Read More

2019-08-06 17:52:00

PME Electroplating Brightener As Leveling And Fast Brightening Agent
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PME, Electroplating intermedaite for nickel plating, Propynol ethoxylate, brightener, leveling agent Specifications Molecular Formula C5H8O2 Assay (GC) 98% Molecular Weight 100.12 CAS No. 3973-18-0 Content in ... Read More

2019-08-06 17:52:00

Bright Acid Tin Plating Process Easy Cleaning Up With No Formaldehyde
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MDT-LS series, bright acid tin plating process, acid tin brighteners, ready to use MDT-LS Full Bright Acid Tin Plating Process (Low Foam, No Formaldehyde) Applications and advantages We developed brand-new full ... Read More

2019-08-06 18:14:03

Full Bright Acid Tin Plating Process For Electrical Parts And Trimmings
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MDT-LS Full Bright Acid Tin Plating Process (Low Foam, No Formaldehyde) Applications and advantages We developed brand-new full bright acid tin plating process with two agents which are Make up solution agent ... Read More

2019-08-06 18:14:03

Low Foam Tin Plating Processes , Metal Surface Treatment Agent With Two Agents
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2019-08-06 18:14:03

SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating
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SLP, Electroplating intermedaite for acid copper, Throwing power, leveling agent in LCD area Specifications Concentration 50% Content in Baths 0.02-0.05ml/L Consumption 1-1.5ml/KAH Appearance Clear transparent ... Read More

2019-08-06 17:43:07

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