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SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

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SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating
SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

Large Image :  SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

Product Details:
Place of Origin: China
Brand Name: Mengde
Certification: ISO9001
Model Number: SLP
Payment & Shipping Terms:
Minimum Order Quantity: 25kg
Price: Negotiation
Packaging Details: Packed in a plastic drum
Delivery Time: 20 working days after received your payment
Payment Terms: T/T
Supply Ability: 10 MT per month
Detailed Product Description
Product Code: SLP Concentration: ≥50%
Applications: Throwing Power, Leveling Agent In LCD Area For Acid Copper Plating Baths Appearance: Clear Transparent Liquid
High Light:

copper electroplating solution

,

copper plating additives

SLP, Electroplating intermedaite for acid copper, Throwing power, leveling agent in LCD area

 

Specifications

 

Concentration ≥50%
Content in Baths 0.02-0.05ml/L
Consumption 1-1.5ml/KAH
Appearance Clear transparent liquid

 

 

 

 

 

 

Description

 

SLP has very good throwing power and covering powder, especially is excellent in LCD leveling. It’s normally used as an intermediate of acid copper additive for printed circuit board plating. SLP is very suitable for printed circuit board through-hole filling. No negative effects occurs if SLP is too much in baths, whereas the more SLP is added to baths, the better effects will be in LCD.

 

Applications

 

SLP can be combined with other nickel plating intermediates such as SPS, SH110, PN, MT-480 and PEG 6000.
SLP can be applied on the following process:

  • Acid copper for PCB (Printed Circuit Board) process

Packing and Storage

 

Packed in a plastic drum, stored in cool and dry place.

 

Product Display

 

SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating 0

Contact Details
Jiangsu Mengde New materials Technology Co.,Ltd.

Contact Person: Mr. oliverhang

Tel: +86 18021229333

Fax: 86-0511-86867404

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