|Yanling town, Danyang city, Jiangsu, China. email@example.com|
Payment & Shipping Terms:
|Applications:||Throwing Power, Leveling Agent In LCD Area For Acid Copper Plating Baths||Appearance:||Clear Transparent Liquid|
copper plating additives,
SLP, Electroplating intermedaite for acid copper, Throwing power, leveling agent in LCD area
|Content in Baths||0.02-0.05ml/L|
|Appearance||Clear transparent liquid|
SLP has very good throwing power and covering powder, especially is excellent in LCD leveling. It’s normally used as an intermediate of acid copper additive for printed circuit board plating. SLP is very suitable for printed circuit board through-hole filling. No negative effects occurs if SLP is too much in baths, whereas the more SLP is added to baths, the better effects will be in LCD.
SLP can be combined with other nickel plating intermediates such as SPS, SH110, PN, MT-480 and PEG 6000.
SLP can be applied on the following process:
Packing and Storage
Packed in a plastic drum, stored in cool and dry place.
Contact Person: Mr. oliverhang
Tel: +86 18021229333
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