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Acid Copper Plating Brighteners (11)

Acid Copper Intermediates (10)

Leveling Agent (15)

Electroplating Wetting Agent (10)

Bright Nickel Intermediates (15)

Nickel Plating Brightener (18)

Nickel Baths Softener (4)

Nickel Bath Purifier (10)

Copper Plating Process (4)

Nickel Plating Process (4)

Tin Plating Process (3)

Electroplating Chemicals (5)

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98% content TPS Sodium Dimethylformamide Propane Sulfonate
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98% content TPS Sodium Dimethylformamide Propane Sulfonate Applications The performance of TPS is similar to that of SP, and its high-temperature positioning performance is excellent, and the brightener component performance is easier to control. Usually TPS is used to replace a part of SP to ... Read More

SPS 27206-35-5 applied to brightener for acid copper plating
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SPS 27206-35-5 applied to brightener for acid copper plating SPS contains increased amount of SP. Replacing SP with SPS to be the acid copper plating brightener agent provides ornamental and functional plating layers. SPS could be combined with nonionic surface-active agent, amine compounds and ... Read More

Polyethylene Glycol Copper Plating Process Carrier / Wetting Agent
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PEG, Electroplating intermedaite for acid copper, Polyethylene glycol, carrier, wetting agent Specifications Molecular Formula HO(CH2CH2O)nH Assay (HPLC) ≥99% Molecular Weight 6000-10000 CAS No. 25322-68-3 Content in Baths 0.05-0.1g/L Consumption 0.4-0.6g/KAH Appearance White crystal Description PEG ... Read More

Leveling Agent Nickel Plating Process 1-(2-Hydroxy-3-Sulfopropyl)-Pyridinium Betane
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PPSOH, Electroplating intermedaite for nickel plating, 1-(2-Hydroxy-3-sulfopropyl)-pyridinium betane, leveling agent Specifications Molecular Formula C8H11NO4S Concentration (%) ≥40.0(UV) Molecular Weight 217.24 CAS No. 3918-73-8 Content in Baths 0.01-0.3g/L Consumption 30-40g/KAH Appearance ... Read More

Leveling Agent And Brightener Nickel Plating Process Making Gorgeous Deposit
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MUSS, Electroplating intermedaite for nickel plating, leveling agent and brightener Specifications Concentration ≥80% Content in Baths 0.003-0.02ml/L Consumption 1-2g/KAH Appearance Yellow liquid Description MUSS is a excellent leveling agent and brightener in all current density areas, which makes ... Read More

N Leveling Agent 1 3 - Ethylenethiourea Imidazoline - 2-Thiol Cas 96 45 7
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N, Acid copper intermediate, 1,3-Ethylenethiourea, Imidazoline-2-thiol, leveling agnet Specifications Molecular Formula C3H6N2S Assay (HPLC) ≥98% Molecular Weight 102.15 CAS No. 96-45-7 Content in Baths 0.0004-0.001g/L Consumption 0.01-0.05g/KAH Appearance White powder Description N helps generate ... Read More

H1 2 Mercaptothiazoline 2 Thiazoline 2 Thiol CAS 96 53 7 White Crystals
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H1, Acid copper intermediate, 2-Mercaptothiazoline, 2-Thiazoline-2-thiol, leveller Specifications Molecular Formula C3H5NS2 Assay (HPLC) ≥98% Molecular Weight 119.20 CAS No. 96-53-7 Content in Baths 0.0004-0.001g/L Consumption 0.01-0.05g/KAH Appearance White crystals Description The uses of H1 are ... Read More

PPS 3 1 Pyridinio 1 Propanesulfonate Electroplating Intermediate For Nickel Plating
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PPS, Electroplating intermedaite for nickel plating, 3-(1-Pyridinio)-1-propanesulfonate, leveller Specifications Molecular Formula C8H11NO3S Assay ≥99% Molecular Weight 201.24 CAS No. 15471-17-7 Content in Baths 0.05-0.02g/L Consumption 10-15g/KAH Appearance White crystalline powder Description PPS ... Read More