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High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces

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High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces

High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces
High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces

Large Image :  High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces

Product Details:
Place of Origin: China
Brand Name: Mengde
Certification: ISO9001
Model Number: PN
Payment & Shipping Terms:
Minimum Order Quantity: 25kg
Price: Negotiation
Packaging Details: Packed in a plastic drum
Delivery Time: 20 working days after received your payment
Payment Terms: T/T
Supply Ability: 10 MT per month
Detailed Product Description
Product Code: PN Concentration: ≥50%
Applications: Throwing Power, Leveling Agent In LCD Area For Acid Copper Plating Baths Appearance: Yellow Liquid
Synonym: A Derivative Of Polyethyleneimine
High Light:

copper plating additives

,

electroplating intermediates

PN, Electroplating intermedaite for acid copper, a derivative of polyethyleneimine, leveling agent in LCD area

 

Specifications

 

Concentration ≥50%
Content in Baths 0.01-0.02ml/L
Consumption 0.5-1ml/KAH
Appearance Yellow liquid

 

 

 

 

 

 

Description

  1. PN is a kind of high molecular polymer which needs to be used in combination with SPS, M, N, AESS or GISS.
  2. PN is powerful in cathodic polarization and remarkably elevates the brightness in LCD areas. When the brightness decreasing, SPS could be added accordingly.
  3. PN is the best high-temperature carrier in acid copper brightener. It is suitable for complex plating pieces.
  4. Widely used within the temperature between 15-45℃, PN is appropriate for both acid copper and non-cyanide zinc plating brightener.

 

Applications

 

PN can be combined with other nickel plating intermediates such as SPS, M, N, AESS, GISS and PEG 6000.
PN can be applied on the following process:

  • Non-dye based bright acid copper for GMF process
  • Acid copper for PCB (Printed Circuit Board) process
  • Hard copper process
  • Acid copper for electrolytic copper foil process

 

Packing and Storage

 

Packed in a plastic drum, stored in cool and dry place.

 

Product Display

 

High Concentration Plating Intermediates , Wetting Agent For Complex Plating Pieces 0

 

 

Contact Details
Jiangsu Mengde New materials Technology Co.,Ltd.

Contact Person: Mr. oliverhang

Tel: +86 18021229333

Fax: 86-0511-86867404

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