High Performance Nickel Plating Brightener, ready to use, bright nickel

Ni-88 High Performance Bright Nickel Plating Process

Applications and advantages

• Used in chromium, bronze, gold, and silver plating as the base deposit under bright nickel layer.
• Has excellent covering and throwing power, especially in LCD area.
• Bright white and esthetic coating with good flexibility.
• High-speed brightening and good leveling.
• Easy to operate and control; has good tolerance against impurities in bath solution

Bath Composition and Working Conditions

Preparation of bath solution

1. Add half volume of water into the standby bath. Heat the water to 60-70℃, add the needed amount of nickel sulfate and nickel chloride. Blend until all is dissolved.
2. Use 10% dilute sulfuric acid to adjust the pH value to 3.0; add 2-3ml/L hydrogen peroxide (30%); blend for half an hour; adjust the pH value to 5.5-6.0 with 4% sodium hydroxide solution; heat to 65-70℃; keep the temperature for half an hour.
3. Sustain the temperature to 50-55℃; add 2-3g/L activated carbon; blend for half an hour; filter into the plating bath.
4. Dissolve the boric acid separately with boiling water; filter into the plating bath.
5. Add water to the required volume; use 10% dilute sulfuric acid to adjust the pH value to 3.0; sustain the temperature at 55℃. Electroplate with the corrugating board as the cathode at DK≈0.3A/dm² until corrugating board is silver gray at LCD areas.
6. Take small amount of plating solution and check with hull cell test. If not normal, continue to electrolyze the solution until it is normal.
7. Add calculated amount of additives into the nickel bath. Engage in trial electroplating until normal.

The functions and replenishment of the additives

• NI-88 make up solution agent helps decrease the internal stress of the deposit, and enables a favorable performance of the coverage percentage in LCD areas. Continuous filtration with activated carbon could only remove a small fraction of NI-88, as well as electrolyzing, which is about 80-120 ml/KAH.
• Do add NI-88 make up solution agent, NI-88 supplementary, wetting agent together to help function when making up nickel solution. NI-88 supplementary consumption amount is 100-150ml/KAH.
• MT-80 Wetting agent helps sustain the tension of the plating solution surface, so as to prevent pinholes. MT-80 is suitable for air agitation as it is a low foam surfactant. ​

Attentions

• The nickel sulfate, nickel chloride, boric acid selected into the solution shall be as pure as possible to enable a favorable performance.
• Boric Acid has low solubility. Filter it by activated carbon first to prevent the precipitation of boric acid then dissolve it with boiling water separately and dump into the bath.
• Corrugated board: Wave-shape board, iron plate is workable. Nickel-plate all the surface before the first use.
• Electroplate the bath solution. First electroplate with the high-current DK≈3A/dm² for 1-2 minutes, then with DK≈0.3A/dm². If coating turns black during the process of electroplating, grind, and then electroplate until the LCD of the corrugated board turns silver gray.

Packing and Storage

Packed in 25kg plastic drums, stored in cool and dry place.

Product Display

Declaration:

The recommendations among the content of this instruction is based on the trials and tests, as well as the related documents which are credible to our company. As the operating practices and equipment differ from each other, we will not hold responsible for any negative outcomes. The content of this instruction could not serve as evidence of copyright infringement.