Wetting Agent, Polyethylene Glycol Powder For Acid Copper, copper baths

PEG, Electroplating intermediate for acid copper, Polyethylene glycol, carrier, wetting agent

Specifications

Description

1. PEG must be used in combination with other acid copper intermediates, such as SPS, M and N, to get brightening deposit.
2. A low content of PEG in acid copper baths can cause brightness and leveling reduced, a excessive content of PEG in baths can remarkably reduce the adhesion.

Applications

PEG can be combined with other acid copper intermediates such as M, N, SPS, MT-580, AESS, etc.
PEG can be applied on the following process:

• Non-dye based bright acid copper for GMF process
• Acid copper for PCB (Printed Circuit Board) process
• Hard copper process
• Acid copper for electrolytic copper foil process

Packing and Storage

Packed in a carboard drum with plastic inner bags, stored in cool and dry place​.

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