MT-580, Intermediate Wetting Agent For Acid Copper Baths, wetting agent

MT-580, Electroplating intermedaite for acid copper, wetting agent

Specifications

Description

1. Proper amount of MT-580 could effectively prevent the appearance of pores. It does well in leveling.
2. There is no hydrophobic membrane on the surface of deposit. It can effectively curbs the decomposition of brightener and elevates the stability of baths.
3. It is a good carrier for the dye-based and non dye-based brighteners. It could totally replace polyethylene glycol (PEG).
4. MT-580 can help to dissolve dyestaff.

Applications

MT-580 can be combined with other nickel plating intermediates such as SPS, PNI, MT-880 and dyestaff.
MT-580 can be applied on the following process:

• Dye based bright acid copper for GMF process
• Non-dye based bright acid copper for GMF process
• Acid copper for PCB (Printed Circuit Board) process

Packing and Storage

Packed in a plastic drum, stored in cool and dry place.

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